Call for Papers
2019 AEIis now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to ASEI2019@163.com  before July 25, 2019. The submitted paper can be in MS WORD format or PDF format Related Files for Downloads:
AuthorInstructions.doc

投稿有關中文說明:
1.國際學術會議官方語言為英語,只接受英文論文,投稿者請務必用英語撰寫論文.
2.請根據格式模板文件AuthorInstructions.doc編輯修改您的文章(Ms Word)。
3.文章長度不得少于4页,不多于6页(投稿時請提交論文的MS Word 版本。
Topics:

The objective of this Conference is to offer a meeting point for professionals and researchers from industry and academia to present and discuss recent advances in the field of Applied Science, Information Technology, Materials Science, Chemistry, Electronic Engineering, Biological Technology etc.

(I) Chemical Engineering and Technology
(01)Fine Chemicals and Specialty Chemicals
(02)Study on Catalyst and Catalytic reaction
(03)New Energy Development and Energy Chemical Engineering
(04)Clean Production and Green Chemical Technology
(05)Polymer Engineering
(06)Energy Conservation and Emission reduction,Chemical Process Intensification
(07)Pharmaceutical Engineering
(08)Biological Chemical and Technology
(09)Electrochemical Engineering
(10)Waste Disposal and Environmental Chemicals
(11)Chemical Thermodynamics and Kinetics
(12)Chemical Process System and Information Engineering
(13)Chemical Machinery and Equipment
(14)Paper and Fiber Engineering
(15)Chemical Surveying Technology and Instrument
(16)Food science and Engineering
(17)Medicine and Biomedical Engineering

(II) Advances in Chemistry Research
(18)Supramolecular Chemistry and Crystal Engineering
(19)Polymer Chemistry
(20)physical Chemistry of Solid Surface and Catalysis
(21)Electrochemistry
(22)Inorganic and Nanometer Materials
(23)Chiral Catalysis and Organic Synthesis
(24)Theoretical and Computational Chemistry
(25)Chemical Biology and Medicinal Chemistry
(26)Analytical Chemistry and Environmental Chemistry

(III) Material Science and Engineering
(27)Non-ferrous Metal material
(28)Iron and Steel
(29)Composites
(30)Micro / Nano Materials
(31)Ceramic
(32)Optical/Electronic/Magnetic Materials
(33)New Functional Materials
(34)Building Materials
(35)New Energy Materials
(36)Environmental Friendly Materials
(37)Earthquake Materials and Design
(38)Biomaterials
(39)Smart/Intelligent Materials/Intelligent Systems
(40)Materials Forming
(41)Materials Machining
(42)Physics and Numerical Simulation of Materials process
(43)Surface Engineering/Coatings
(44)Modeling, Analysis and Simulation of Manufacturing Processes
(45)Welding & Joining
(46)Mechanical Behavior & Fracture
(47)Material Design of Comupter Aided
(48)ToolingTesting and Evaluation of Materials

(IV)Computer Science and Technology
(49)Parallel Distributed Computing
(50)Computer Networks and Communication
(51)Information Storage
(52)Trusted Computing and Fault-Tolerant Computing
(53)Distributed Computer System
(54)Embedded Software
(55)Operating System
(56)Database System
(57)Software Engineering
(58)Artificial Intelligence and Machine Learning
(59)Cognitive Sciences and Image Thinking Simulation
(60)CAD/Computer Graphics(CG)
(61)Integrated Manufacturing System
(62)Intelligent System Design and intellisense
(63)Intelligent Decision Support
(64)Computer Vision and Intelligent Robot
(65)Information Security

(V) Electronics and Information Technology
(66)Circuit Theory and its Application
(67)DSP and Channel Coding Technology
(68)Embedded System
(69)Intelligent Instrument and Detection Technology
(70)Electromagnetic and Microwave Technology
(71)Microelectronic Devices and Technologies
(72)Information Optics and Electro-optical Communication
(73)Sensor Technology
(74)System Integration Technology
(75)Optical Fiber Communication
(76)Digital Video/Image Communication
(77)Computer Communication and Network Security
(78)Wireless Communication Technology
(79)Statistical signal processing
(80)Bioinformatics
(81)Intelligent Information Processing
(82)Pattern Recognition and Intelligent System
(83)The Guidance Navigation and Control (GNC)
(84)Precision Instrument and Machinery
(85)Power Semiconductor Devices and Power Integrated Circuit
(86)Semiconductor Devices Reliability

(VI) Management science and Engineering
(87)E-commerce and Its Management
(88)E-government and Its Management
(89)Manufacturing Management
(90)Management Information System
(91)Technology Management of Education and Research

 

 

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LiLink: Editor. Hu Email: ASEI2019@163.com Tel:17721434960